| Project Summary | Project Information |
|---|---|
|
This project will combine several pieces of technology into a small configurable multi-spectral camera module with integrated spatial orientation sensors. The customer desires to create a small ruggedized signal processing platform that will withstand harsh environments and perform automated image capture. The goal of this project is to combine several existing pieces of hardware into a demonstration unit for the customer's technology. |
(See Project Readiness Package Document in Planning Section)
|
Team Documents
| Planning | Concept Level Design | System Level Design |
|---|---|---|
|
Project Readiness Package Document |
Concept Design Review Documents (SD I) Detailed Design Review Documents (SD I) Managerial Design Review Presentation (SD I) Technical Conference Publication (SD II) Poster Publication (SD II) Managerial Design Review Presentation (SD II) Photo Gallery |


