P08312: Dynamic Thermal Monitoring and Management for Mobile Processors

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Table of Contents

1 Project Overview
2 Administrative Information
3 Team Documents

Project Overview

The aim of this project is to design an ASIC (Application Specific Integrated Chip) to measure the real-time thermal data of individual processing units and interface the thermal map on to a host machine (or a listener program that generates web-pages on a web server). To enable the temperature monitoring of individual units, a small array of thermal sensors will be interfaced with a microcontroller. The thermal sensors will monitor the on-die junction temperature and provide a digital signal that signifies when on-die temperature is above a pre-programmed value. If the on-die temperature reaches such a threshold point then the system should be entering into a thermal safe mode.

Administrative Information

Project Name: Dynamic Thermal Monitoring and Management for Mobile Processors

Thermal Image of Processor

Project Number: P08312
Track: Systems and Control Technologies
Start Term: 2007-1
End Term: 2007-2
Faculty Guide: Dr. Pratapa Reddy (Computer Engineering)
Faculty Consultant: George Slack (Electrical Engineering)
Graduate Teaching Assistant: Michael Michael (Computer Engineering)
Primary Customer: Dr. Dhireesha Kudithipudi
Customer contact information: e-mail:; phone: X5085

Team Documents

Published Documents

As you conclude the project, include links to all of your finished and fully polished documents here. The previous sections of the web site contain the entire design history of your project. This section contains the finished products. Add more links as needed.

Concept Design Review Documents (SD I)

Detailed Design Review Documents (SD I)

Managerial Design Review Presentation (SD I)

Technical Conference Publication (SD II)

Poster Publication (SD II)

Managerial Design Review Presentation (SD II)

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