For 25 years process improvement has been overlooked at Dresser-Rand's facility. There are many opportunities at making improvements throughout the facility.

• Many problems could be individual capstone projects

• Proposing quick and inexpensive solutions to several problem areas is the focus of this project

After initial review of Dresser-Rand Piping and Packaging area it has been determined that the best approach is to break up the floor into several subsystems:

• Facility Layout
• Weld Booths
• Consignment and VMI Inventory
• Tubing and Instrumentation
• Pipe Prep & Cutting and Bending
• Hydro and Cleaning
• Final Packaging

5 Minute Project Commercial

Project Name

Process Improvement Project

Project Number

P09457

Project Family

Sustainable Technology of the Global Market

Track

Process Improvement Initiatives

Start Term

2008-2

End Term

2008-3

Faculty Guide

Professor John Kaemmerlen (IE)

Primary Customer

Dennis Rice, Process Innovation Director at Dresser-Rand

Team Member Schedules

Design Project Management

Mission Statement

Staffing Requirements

Intellectual Property Considerations

Preliminary Work Breakdown Structure

Team Values and Norms

Required Resources

DPM Final Presentation

Multidisciplinary Senior Design I

Identify Customer Needs

Establish Target Specifications

MSD I Scheudle

Value Stream Map and Process Flow

Multidisciplinary Senior Design II

MSD II Quarter Schedule

Facility Layout

Weld Booth

Hydro Table

Case & Head Hydro Testing

Consignment

Time did not allow for looking into the following subsystems:

• VMI
  
• Final Packaging
  
• Tubing and Instrumentation
  
• Pipe Prep, Cutting, & Bending
  

*Note - To view Kaizen information on:

Welding Rod Reorder Process - See Weld Booth

Consignment Footprint Reduction - See Consignment

Concept Design Review (SD I)

Detailed Design Review (SD I)

Managerial Design Review Presentation (SD I)

MSD I Test Plan

Objective evaluation of teams successes.doc

Team Self-Assessment of Values and Norms

Imagine RIT Poster

Technical Conference Publication (SD II)

MSD II Design Review Presentation (SD II)

Follow up Opportunities