P14571: Ruggedized Camera Encoder
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Systems Design

Table of Contents

This section of the Ruggedized Camera Encoder (RCE) wiki documents the process that was followed in designing the RCE system. Here is presented the systems analysis, architecture, and the engineering process.

Trade Analysis

This section is devoted to the research of technologies relevant to the RCE system design.

Nine products, similar to the RCE were analyzed on 25 different metrics. From this analysis it was concluded that the final RCE system would need to meet several technical requirements to be considered competitive against the other comparable technologies:

Comparable Systems Trade Analysis

This section provides an in depth benchmark analysis of other devices with a similar feature set to the RCE system. Nine different products were evaluated on 25 different metrics. From this benchmarking process, several design decisions were made. The data used for the analysis are provided in the following document. Furthermore, the analysis is provided in the Subsystem Design Review document in the System Overview section.
Dimensions of products comparable to the RCE system. The Averages of each dimension (''across the 9 devices'') have also been depicted.

Dimensions of products comparable to the RCE system. The Averages of each dimension (''across the 9 devices'') have also been depicted.

Power Summary Temperature Summary
Summary of the power consumption of the other technologies. Minimum and maximum values are indicated for the power consumption. The minimum and maximum operating voltages are also indicated.

Summary of the power consumption of the other technologies. Minimum and maximum values are indicated for the power consumption. The minimum and maximum operating voltages are also indicated.

Summary of the operating temperature for the comparable technologies. The absolute value of each minimum temperature is depicted (to improve clarity).

Summary of the operating temperature for the comparable technologies. The absolute value of each minimum temperature is depicted (to improve clarity).

FPGA Technologies

This section presents the FPGA trade analysis that was completed to determine which FPGA was suitable to meet the processing and interface requirements.

FPGA Trade Analysis Rev.A (3/18/2014)

Memory Technologies

This section presents a trade analysis of storage technologies. The complete analysis is provided in the PDF document within this section. A chart has been provided that portrays a summary of the devices that were reviewed.

Rugged Hard Drive Trade Analysis Rev.A (4/1/2014)

 The summary of the storage devices that were analyzed as a part of this benchmarking process.

The summary of the storage devices that were analyzed as a part of this benchmarking process.

Connectors

This section provides the documentation and trade analysis concerning the ruggedized-waterproofed connectors.
Ruggedized-waterproofed connectors analysis data summary.

Ruggedized-waterproofed connectors analysis data summary.

Concept Development (generation, improvement, selection)

The overall design process and deliverables have been provided in this section.

Customer Block Diagram

This section depicts the expected final system, as defined by the customer.
Design Core & daughter card high-level diagram.

Design Core & daughter card high-level diagram.

PUGH Chart

The PUGH descision-matrix methodology was utilized to conduct a quantitative concept selection for the complete RCE system.
PUGH Chart

PUGH Chart

Functional Decomposition

The RCE functionality was designed to accomplish the functions depicted in the following diagram; Note: CR = Customer Requirement.
Functional Decomposition.

Functional Decomposition.

Subsystems

RCE Subsystems Subsystem-to-CRs Mapping
The main RCE system was decomposed into its proper subsystems. Each subsystem was categorized into one of three categories: mechanical, electrical, or software (subsystem).

The main RCE system was decomposed into its proper subsystems. Each subsystem was categorized into one of three categories: mechanical, electrical, or software (subsystem).

The subsystems were linked to the customer requirements.

The subsystems were linked to the customer requirements.

Mechanical Design

This section is presents the design progress concerning the mechanical subsystems.
Block diagram of the mechanical subsystem.

Block diagram of the mechanical subsystem.

Enclosure Isometric View Enclosure Exploded View
An isometric view of the enclosure.

An isometric view of the enclosure.

An exploded view of the enclosure.

An exploded view of the enclosure.

Mechanical Design #1 Mechanical Design #2
The mechanical system uses a pre-built SSD drive tray.

The mechanical system uses a pre-built SSD drive tray.

The mechanical system has been configured such that the storage devices are directly under the main PCBs.

The mechanical system has been configured such that the storage devices are directly under the main PCBs.

Electrical Design

Everything pertinent to the electronic design of the system, from the PCB design to electromagnetic interference (EMI), has been summarized in this section.
Electrical Subsystem CXP HSMC Subsystem
RCE daughter card and mezzanine card.

RCE daughter card and mezzanine card.

CoaXPress HSMC card block diagram.

CoaXPress HSMC card block diagram.

CXP Communication Pre-Detailed Design Research Rev.A (3/13/2014)

Software Design

Software System Diagram
This is a generic block diagram of the flow of the software.

This is a generic block diagram of the flow of the software.

Risk Assessment

The risks associated with the RCE project were identified and compiled into the formal assessment provided within this section.

Risk Assessment Rev.A (2/12/2014)

Systems Design Review

A presentation was delivered on March 11th to peers, the customer (Steve Brown), and faculty mentors. From this experience, the design process has received incremental improvements.

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