P16102: RIT-SPEX Structure
/public/

Integrated System Build & Test with Customer Demo

Table of Contents

Your website should document your journey through MSD, so include work-in-progress as well as latest results. Use pdf's for display whenever possible so that information is easily viewable without the need to download files and open applications. (Your EDGE file repository should still contain original editable files).

Team Vision for System Level Demo with Customer

Product I

This phase, we have our first product to incorporate Ultem structure, aluminum rails, a mass analog and all wiring. We call this iteration Product I. All of the testing and analysis for this phase is made using Product I.
Product I (4/13/16)

Product I (4/13/16)

Ultem Printing

This phase, we received the printed Ultem parts we ordered from Stratasys. Due to a miscommunication, Stratasys printed an older revision of our design instead of the most recent one we went them. The fidelity on these prints is extremely good. Holes and wire paths do not not have the kind of deformation we saw with ABS.
Ultem Printed Components (4/7/16)

Ultem Printed Components (4/7/16)

Mass Analog

To mimic the presence of internals during vibration tests, a mass analog is used. We have made a revised mass analog for this phase. The mass analog has a 3-D printed ABS structure with steel rods inserted for added mass. The target mass for the analog is 930g. As shown in the image below, the actual mass created is 935g, which walls within the acceptable range. We believe that this mass analog will accurately represent the presence of internals during testing.
Mass Analog (4/13/16)

Mass Analog (4/13/16)

Testing

Table Top Deploy III

To test the reliability of the solar panels to deploy, a table top deployment test was run.

Test Plan

Table Top Deployment Test Plan (4/13/16)

Table Top Deployment Test Plan (4/13/16)

Video of Test

Table Top Deploy with Ultem

Results

During the test, one and only one of the panels deployed. The second panel did not deploy because the restraining line on that side never melted all of the way through and the old wire routing pinched the line, not allowing it to go slack from the other side being cut. We also noticed some interference between the hot plate standoffs and the deployable backer panels.

Takeaways

The outdated design caused exactly the same problems that lead us to change them in prior iterations. We believe that once we have the most recent design printed out of Ultem, deployment will be successful. We will also adjust the positioning of the NiChrome wire so that it has better contact with the restraining line, facilitating melting.

Fit Test II

Fit Test Plan(2/23/16)

Fit Test Plan(2/23/16)

Test Plan

Fit Test CheckList (2/23/16)

Fit Test CheckList (2/23/16)

Results

Results FitTest 2 (4/13/16)

Results FitTest 2 (4/13/16)

Takeaways

High Altitude Balloon

Test Plan

With this opportunity, we'll ride on the side of the HAB II Launch (April 22nd target date) to test the thermal characteristics and low pressure deploy of the cubesat frame design. The balloon will ascend to 60,000 to 100,000 feet, run both hot knifes wired in parallel for ten seconds and deploy the arrays. A camera will be trained on the vehicle for the duration

Results

Temperature Regime: -56 to -45 degrees Celsius (-70 to -50 degrees Fahrenheit) Pressure Regime: Approximately 1/10th of Surface (1.692 lb/in2 versus 17.554 lb/in2)

Takeaways

Risk and Problem Tracking

With the arrival of Ultem from Stratasys, we are confident that we will not require RIT to print Ultem for our project this semester. Because of this, we can remove RIT's ability to print Ultem from our risks.

Updated Risk Assessment(4/13/16)

Updated Risk Assessment(4/13/16)

The arrival of the Ultem parts closes two problems but creates another. We have shown that we can obtain Ultem so problems around ordering and printing it are over. However, the Ultem parts sent to us were from the wrong design revision and do not reflect the most recent changes. This represents a new major problem for us.

Updated Problem Tracking(4/13/16)

Updated Problem Tracking(4/13/16)

Bill of Materials

This phase we ordered components for the deployment switch and for analog solar panels. These orderes are reflected on the new BOM. Also reflected is the arrival of printed Ultem from Stratasys.
Updated B.O.M. (4/12/16)

Updated B.O.M. (4/12/16)

Final Deliverables

Engineering Requirements

ER and Description Minimum Ideal Current Status?
1 Min Undeployed Area Time (cm2-orbit) 100 100 100 SATISFIED
2 Deployed Area Time (cm2-orbit) 150 300 300 SATISFIED
3 System Mass (grams) 420 300 180 (460 with solar panels) SATISFIED
4 CubeSat Clearance (mm) 1 1 >1 SATISFIED
5 Time from Command (s) 2<t<8 2<t<8 ~ 7 SATISFIED
6 Operating Temperature (deg C) (-40,40) (0,20) ? ?
7 Available Interior (mm) 96 90 85 100 100 100 Pumpkin CubeSat PCB Standards SATISFIED
8 Exterior Protrusion Space (mm) 6.5/face 6.5/face 6.5 two faces, 4, two faces SATISFIED
9 Change in COM (mm) 50 >10 >1 SATISFIED-Simulation
10 Constant Launch Acceleration (g) 6 8 6-survived SATISFIED-Simulation
11 Cost of Prototype ($USD) 500 400 $500 SATISFIED
12 Time to Remove Blank (s) 8 6 ? ?
13 Launch Vibration Test (Pass/fail) Pass Pass SATISFIED-Simulation
14 Full Documentation Pass Pass Pass SATISFIED

Mass Breakdown

Mass Breakdown(4/13/16)

Mass Breakdown(4/13/16)

Imagine RIT Poster

Below is the most up to date version of the poster we will present at Imagine RIT. As we complete the remaining tests and builds, the rest of hte poster will fill in.
Current Revision of Poster (4/7/16)

Current Revision of Poster (4/7/16)

Technical Paper

We have begun work on our final technical paper. We are approximately 50% of the way into the writing of the paper. We believe we are on track to meet the 75% by 4/21 deadline.
Excerpt from Technical Paper (4/7/16)

Excerpt from Technical Paper (4/7/16)

Plans for next phase

Gannt Chart

Updated Gannt Chart (4/14/16)

Updated Gannt Chart (4/14/16)


Home | Planning & Execution | Imagine RIT

Problem Definition | Systems Design | Subsystem Design | Preliminary Detailed Design | Detailed Design

Build & Test Prep | Subsystem Build & Test | Integrated System Build & Test | Integrated System Build & Test with Customer Demo | Customer Handoff & Final Project Documentation