Build & Test Prep
Table of Contents
Team Vision for Build & Test Prep Phase
All of the crucial design components are set and a full
understanding of how they interrelate is known, but we
believe the design elements that are not crucial are
better to leave flexible since we are beginning with a
predefined structure, i.e. the ETC, and the design
process cannot be faultless. For this reason some of the
design parameters are left with a range rather than an
exact value. As we begin to construct the test chamber
the final dimensions will be revealed. For now we have
sufficient documentation to move forward with the MSD II
We planned to review everything we did last semester, to bring us up to speed with what we have to accomplish in the coming weeks to put us in great position for the remainder of the semester. We also planned to review our part orders we have made, and have them shipped so we can begin initial tests.
We accomplished initial tests for the electrical components, and we are set to begin initial tests for the mechanical components by mid next week. The mechanical components are still in transit and should be received by the end of this week.
All major component ordered have been completed, and we see ourselves in great position having all initial tests completed going into Phase 2.
Test Plan SummaryAs the parts ordered start to be delivered next week, the team will begin testing of the subsystem components individually and then, eventually, all together.
Access and verify 12V power supply built into ETC. (If it is not stable, order an AC/DC converter)
The test plan summarizes which components will be tested and when, as well as a projection of when the overall system will be tested.
Please click here for an updated Test Plan
Electrical Component Verification
Updated Draw Design
Risk and Problem Tracking
Please Click here for an updated Risk Management
Plans for next phase
That the microcontroller (MSP) can be initialized, read the sensors and write to the display the raw values on the LCD screen.
- Individual testing and subsystems communication
Eg. Thermal sensors, UI
Eg. Does humidifier/heater react with sensors and inputs
- ASTM thermal conductivity test done.
The molds should be done. Machine aluminum rod.
If week 5 goes as planned, then by week 8, we should be running test sequences, and ironing out bugs and finding anomalies.