P17201: TigerBot VII: The Force Awakens
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Build & Test Prep

Table of Contents

Team Vision for Build & Test Prep Phase

The team convened two weeks prior to the beginning of Spring semester to put in valuable work in order that TigerBot VII may be completed on time considering the vast scale of the project. In addition to finalization of Mechanical designs, the Electrical team converged on ready-to-order rev 1 PCB designs. The primary system-level progress points made during Intersession are listed below and will be further detailed.
System-Level Progress

System-Level Progress

Mechanical Team R&D Progress

The Mechanical team has a number of research and development mini-projects running in parallel with the primary system-level project work. These specialty-focus components require additional materials testing, sourcing, or preliminary research for concept validation before making it into the final design. Shown below are the Mechanical team's R&D focus projects from the intersession.
Cooling System

Cooling System

CrumpleStop

CrumpleStop

Plastidip Foam

Plastidip Foam

Manufacturing Progress

The largest remaining barrier to the completion of TigerBot VII is the large volume of parts that must be manufactured. Many components have been redesigned to facilitate more rapid manufacturing, enabling greater throughput without sacrificing critical performance goals. In addition, the team has fully verified the material bounding boxes to all of the machined parts, allowing for more raw material to be confirmed and ordered. The incoming orders of metal along with the staged release of drawing packages lets the team leverage university machining staff to parallelize manufacturing.

Electrical Team Progress

Software Testing/Planning

Test plans were made and implemented to test ROS communication between the ODroid and the Teensys:

The Communication Stability test led to the design of a Heartbeat function to keep track of the statuses of the Teensys:

Heartbeat Diagram

Heartbeat Diagram

Clarification of Software User Interface Requirements:

To-do:

Schematic/PCB Design

Board Stack Concept

The overall board concept requires a high level of functionality, a small footprint and modularity for future development. This lead to the stack up design seen below.
Board Stack

Board Stack

Teensy Breakout Board

The top board of the stack is the Teensy Breakout, which networks the micro controller to the necessary I/Os. A 12V to 5V switching regulator was incorporated into the design in order to handle the large power drop from the 12V to 5V line. Future revisions are in the works to reduce the footprint size and stack height.
Teensy Breakout Schematic

Teensy Breakout Schematic

Teensy Breakout Board

Teensy Breakout Board

Motor Interfacing Board

The motor interfacing board handles the logical interfacing between the Teensy, the Clearpath Servos and CUI/Zettlex encoders.

Motor Interface Schematic

Motor Interface Schematic

Motor Interface Board

Motor Interface Board

Current Sensing Board

Current sensing was determined to be a necessity for implementation of torque controlled algorithms. The current draw from the Clearpath Servos is measured through a shunt resistor/amplifier configuration that outputs an analog voltage level to be fed up the stack to the Teensy for correlation.

Current Sensing Board Schematic

Current Sensing Board Schematic

Current Sensing Board

Current Sensing Board

Purchasing

Test Plan

The Hardware DVT document outlines the procedure for testing and verifying PCBs.

Design Review Materials

For the EE Design Review held early this semester:

Plans for next phase


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