P17551: Sandia Instrumented 3D Printer/public/
Customer Handoff & Final Project Documentation
Table of Contents
Team Vision for Final Demo and Handoff
Shared Vision for Customer Handoff Review
- The LED matrix will be implemented with the sensor network. Jon will be optimizing the LED matrix and making it look better as well as fixing the color. This will be ready to demonstrate at Imagine RIT.
- Further analysis of the printed NIST specimens will be done, and analysis presented at the Week 15 Review.
- The technical paper will be completed and presented at the Week 15 Review.
- Firmware will be updated to our specifications and in use at Imagine RIT.
- The sensor network will be stress tested by the Week 15 Review.
- The thermal camera system will be implemented and will record thermal history. This will be demonstrated at Imagine RIT.
- Giveaway parts for Imagine RIT will be printed ahead of time to meet anticipated demand, and further printing of the part to demonstrate the printer’s abilities will happen at Imagine RIT.
- Further control charts will be made after corrections to the sensor array. A sample control chart will be demonstrated at Imagine RIT.
- Sensor Network code will be operational on the Raspberry Pi by Imagine RIT.
Satisfaction of Customer and Engineering Requirements
- The full document for customer and engineering requirements can be found here.
Risk and Problem Tracking
- The full risk management document can be found here.
- The full problem tracking document can be found here.
Final Project Documentation
- The final technical paper can be found here.
- The final poster can be found here.
- The final Bill of Materials can be found here.
- Sensor network guide can be found here.
- The guide for using the cameras with the Raspberry Pi can be found here.
- Component datasheets, including Arduino files and Sensor Network PCB files, can be found here
- All of the BCN3D Sigma CAD and all mounting brackets and test parts can be found here.
BCN3D Sigma Operation Helpers for PLA
- The printer has a default extruder that it uses. In order to change to the other extruder, you must manually enter T1 at the beginning of the gcode file.
- When printing we close the front of the enclosure but do not secure the velcro to allow a little ventilation. Without this, you may experience heat creep.
- The optimal range for bed temp is between 70C and 80C while the optimal range for extruder temp is between 205C and 215C for best quality parts.
- The filament may break inside the tubes when the printer is left idle for more than a couple of days. Remove the filament if the printer won't be used for more than 4 or 5 days.
- The front cameras MUST BE REMOVED for a full calibration. The extruders will hit them from the side if they are not removed. It may not cause any damage to the cameras but it could harm the mount, extruder or even wear down the belts.
- All of the GCODE files we have used to print our parts are located in the zip file here.
Arduino Code Helpers
- Due to the current Arduino program using too much of the SRAM it is advised that the LED matrix section of the program be moved to a separate Arduino. To communicate between the Arduino controlling the sensor network and the one being used for the LED matrix, interfacing the two Arduinos using SPI is advised. Using the sensor network Arduino as the master, digitally write out the values recorded from the sensors and have them read into the slave Arduino for controlling the LED matrix.
- The wiring explanation can be found here.
BCN3D Sigma Firmware Documentation
- The documentation for the Firmware is fairly extensive and quickly explains what the purpose of each file is, and explains what certain groupings of files are used for.
- The documentation for this can be found here.
Plans for Wrap-up
Future Project ProposalsThe following document details all of the wrap-up/future plans for the Instrumented 3D Printer project. Future Plans.
- ASTM Standard D638-14, 2003, "Standard Test Method for Tensile Properties of Plastics," ASTM International
- Russell, Debra L. F. "NIST Additive Manufacturing Test Artifact." NIST. N.p., 08 Feb. 2017. Web. 09 May 2017.
Three Week Plans
- Mike's three week plan.
- Ryan's three week plan.
- Maseo's three week plan.
- Justin's three week plan.
- Jacob's three week plan.
- Jon's three week plan.
Gate Review Meeting Notes
- Meeting Notes from the Genesee Brew House, 5/17/2017
- Discussed importance and relevance of different stakeholders, understanding different perspectives
- Reviewed MSD I & II phases/timelines and importance of perspective
- Different aspects of MSD motivation from guide perspective were discussed, as were levels of student performance
- Overview of 9 ABET Outcomes and how they pertain to our project
- Discussed Bloom's Taxonomy and how it pertains to MSD
- Hands-on examples demonstrated with DVD player mechanisms, tomato stems, and a car scanner
- Reviewed overall team behavior characteristics
- Maslow's Hierarchy was introduced and discussed
- Process tools were reviewed
- Behaviors such as iteration, different project views (perspectives), and documentation consistency were reviewed and built upon
- Utilized problem-solving skills to understand operation of Wimshurst Machine
- Overall, the final gate review concluded MSD and allowed the team to reflect upon the different challenges we faced throughout our project.