Subsystem Build & Test
Table of Contents
Team Vision for Subsystem Level Build & Test PhaseWhat We Planned to Do:
- Begin work on LabView code
- Solder and wire strain gauges
- Update risk assessment and project plan
- Update WBS links on EDGE
- Test and validate amplifier circuit
- Test and validate Bluetooth functionality
What We Did:
- Began work on LabView code
- Soldered and wired strain gauges
- Updated risk assessment and project plan
- Updated WBS links on EDGE
- Tested and validated Bluetooth functionality
- Tested amplifier circuit
- Consulted subject matter expert, Mike Walker
- Tested deflection of structure and validated against ANSYS model
What Went Wrong:
- Voltage output from Wheatstone Bridge is too low (1/1000 of expected voltage)
- Amplifier circuit is not able to boost the signal enough to be usable
- Possible causes include:
- Incorrect strain gauge placement
- Faulty solder/wire connections
- Faulty amplifier circuit
- Structure may be too rigid
- Incorrect testing procedures
What Will be Done:
- Re-analyze amplifier circuit for micro volts
- Come up with integration solution
- Schedule dates for test plans to be carried out
Test Results Summary
Click here to download a pdf version of Test Plan S6.
Risk and Problem TrackingRisk Assessment
Functional Demo Materials
- The functionality of bluetooth transmission will be demonstrated during this review. The first demonstration will show transmission of packets of data from the MSP430 as planned for the project.
- The next demonstration will show a signal from a function generator to a MSP432 being sent over bluetooth and plotted live.
- As per test plans, bluetooth transmission capability was found to be 150 ft in the machine shop.
Using a pulley and weight system and a milling machine to hold the rotating dynamometer in place while keeping a static load on it.