P18071: Wireless Concussion Detection
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Detailed Design

Table of Contents

Team Vision for Detailed Design Phase

Summary: With the preliminary design of the project being completed and feedback from the customer being heard, more detailed designs and flowcharts were to be laid out. The main focus for this section on the mechanical side was to adjust our options for a text fixture based on the conversation with the customer. This way we could begin construction of the test fixture and begin preliminary tests in the next phase. The software focus on the other hand was to continue with connection of nodes together. While this was being done some problems were encountered which brought along some concerns to the current workflow of the project. The focus is now to continue with the majority of components and their workings, while discussing and researching on which type of UI to go forward with.

Goals

Software

Electrical

Mechanical

Completed

Software

Electrical

Mechanical

Progress Report

Our full Progress Report can be found here.

Software:

Electrical:

Mechanical:

Prototyping, Engineering Analysis, Simulation

Temperature

Low Temperature Analysis: The low temperature analysis will be preformed at -23 to -27°C. Helmets shall be conditioned for a period of not less than 4 h nor more than 24 h. Then Fully tested. The Guardrail boards, while usually used in coal mines that can be over 36°C, are stored with their respective equipment outside. These boards have maintained functionality through several winters. Low environmental temps are not foreseen to be an issue for the Guardrail sensor boards.

High Temperature Analysis: The high temperature analysis of the boards will be at a temp of 28 to 32°C. Helmets shall be conditioned for a period of not less than 4 h nor more than 24 h and then fully tested for functionality. The Guardrail boards spend most of their working lifetime in coal mines that can reach over 36°C (100°F) therefore high environmental temps will most likely not cause issues for the Guardrail sensor boards.

Testing and Sensor Placement

Sensor Type and Placement: Previous researchers have used sensor systems similar to ours. The University of North Carolina conducted research on their football players using a similar 3 axis accelerometer mounted directly to the hard plastic of the helmet. The exact location of the sensor was not mentioned in the UNC research (which can be found in our references) and will have to be a point of further testing on our part.

Drawings, Schematics, Flow Charts, Simulations

Software

Option 1 Data Flow Chart

Option 1 Data Flow Chart

Option 2 Data Flow Chart

Option 2 Data Flow Chart

Raspberry Pi UDP Flowchart

Raspberry Pi UDP Flowchart

Raspberry Pi Bluetooth Flowchart

Raspberry Pi Bluetooth Flowchart

Raspberry Pi Amazon Database Connection

Raspberry Pi Amazon Database Connection

Android Application Flowchart

Android Application Flowchart

Mechanical

Helmet Shell CAD Model

Helmet Shell CAD Model

Impact Test Bed Exploded View

Impact Test Bed Exploded View

Impact Test Bed

Impact Test Bed

Electrical

PCB Layout Schematic

PCB Layout Schematic

PCB Layout Schematic

PCB Layout Schematic

PCB CAD Drawing (Top)

PCB CAD Drawing (Top)

PCB CAD Drawing (Bottom)

PCB CAD Drawing (Bottom)

Test Plans

Software Testing

Shock Testing

Updated Testing Flowchart

Updated Testing Flowchart

For one helmet conditioned at ambient conditions:

12.2.1 Front—The point on the midsagittal plane which is 50 mm (1.969 in.) above the anterior intersection with the reference plane.

12.2.2 Side—The point 25 mm (0.984 in.) above the reference plane and 90° from the anterior intersection of the midsagittal plane and the reference plane (intersection of the reference and coronal planes).

12.2.3 Rear—The point at the posterior intersection of the midsagittal and reference planes.

12.2.4 Crown—The point where the central vertical axis meets the top of the headform.

12.2.5 Rear Boss—A point in a plane 135° (2.36 rad) in a clockwise direction from the anterior intersection of the median and reference planes and on the reference plane.

12.2.6 Front Boss—A point in a plane 45° (0.78 rad) from the median plane as measured in a clockwise direction and 25.4 mm (1 in.) above the reference plane.

12.2.7 Test Line—Draw test line A-B-C-D-E-F on the headform as indicated in Fig. 8.

For a second helmet conditioned at ambient conditions:

12.2.8 Non-Prescribed Impact Locations—Non-prescribed impacts shall be located on the headform. The first point of contact with the anvil for any non-prescribed impact location shall be on or above the test line and at least one-fifth of the circumference of the headform from any prior impact location on that helmet. The headform is positioned so that the impact location is the first point of contact with the anvil. The helmet is then placed on the headform as specified by the manufacturer’s head positioning index (HPI). The location of these two non-prescribed impact locations may be identified by the arc distance along the reference plane from the anterior intersection of the midsagittal plane with the reference plane, clockwise or counterclockwise, and the perpendicular arc distance from that point on the reference plane to the non-prescribed impact location.

Temperature Testing

11.1.2 Low Temperature—The low temperature is at a temperature of -23 to -27°C. Helmets shall be conditioned for a period of not less than 4 h nor more than 24 h.

11.1.3 High Temperature—The high temperature is at a temperature of 28 to 32°C. Helmets shall be conditioned for a period of not less than 4 h nor more than 24 h.

11.1.4 Testing for Conditioned Specimens—Complete all testing on helmets within 5 min after removal from the conditioning environment. Helmets may be returned to the conditioning environment in order to meet this requirement. Prior to the resumption of testing, specimens must remain in the conditioning environment for a minimum of 15 min for each 5-min period they are out of the conditioning environment. The hot and cold conditioned helmets will be impacted at the two positions found during Test 1 that displayed the highest impact data.

PCB Testing

A prototype can be ordered in advance to be ready for testing during the start of MSD II. An alternative would be to order just the components and use a protoboard to test the design. Main concerns to test for:

Bill of Material (BOM)

Purchased Materials

Possible Purchases

Updated BOM

Updated BOM

Risk Assessment

High Level Risks

High Level Risks

For a full list of Risks, click here.

Requirements

We have narrowed our Customer and engineering requirements to fit the scope of our project. With our current budget and time constraints we believe that we for see no issues with meeting our goal of having a working prototype by may.

Here are the current Customer and engineering requirements.

Engineering Requirements

Engineering Requirements

Customer Requirements

Customer Requirements

Design Review Materials

A link to our preread document can be found here

Plans for next phase

Individual Three Week Plans

Josh Metzger

Robbie Frumusa

Brittany Lacy

Max Reitz

Jimmy Cummings

Isaac Garland

Gantt Chart

Gantt Chart

Gantt Chart


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