P18104: High Altitude Balloon Instrumentation Package
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Build & Test Prep

Table of Contents

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Project Recap

The High Altitude Balloon Instrumentation Platform (HABIP) is a multi-functional system that allows users to collect and analyze data from near-space experiments. The device records internal data, and also telemeters data that has been gathered from an array of sensors to a ground communications center. The goal of this project is to create the aforementioned array in a configuration that is lightweight, cheap to manufacture, and highly reliable. The final product will undergo a mission lasting for several hours in harsh conditions, and will parachute back to Earth from an altitude of over 100,000 feet to be recovered and analyzed. This project seeks to improve upon the progress of two former MSD groups: P17104 and P17105, and is intended to be a design which can be further improved in the future.

Team Vision for Build & Test Prep Phase

In the short time since the beginning of the semester, the team has focused on getting each subsystem prepared for testing. Due to the nature of the project, many subsystems will be very easy to test independently of each other, while we will only know that other engineering requirements are met upon launch. As such, additional time has been focused on ensuring the integrity of the design to increase the probability of success.

During this phase, the team worked on creating test plans and doing some pre-testing setup, to make the next phase go smoothly and follow a specific procedure. Our risk/problem assessment was updated, and the team had several discussions about how we would approach any unexpected situations.

Test Plan Summary

Engineering Specifications

Engineering Specifications

To view the full document, click here.

The test plans (below) are designed to ensure that the engineering requirements (above) that were defined in the Project Readiness Package are met.

Test Plan

APRS

DTV

Ground Communications

GRSS

Reaction Wheel

DACQs

Subsystem Updates

MSP430 -- Teensy SPI Interface Control Document

The SPI bus between the MSP430 (master) and Teensy microcontroller (slave) is detailed in this ICD.

Sensors/Commands/Data Formats

This text file gives an example of the SD Card file formatting.

Transmitter Power Amplifier

The power amplifier calculations were finalized, paving the way for our last set of large purchases to be completed.

Risk and Problem Tracking

Mitigated Risks

Ongoing Risks

New Sources of Risk

Problem Tracking

Problem Tracking

Problem Tracking

To view the full document, click here.

National Engineers Week Conference

Our team will be represented by Dan Mitchell at Boeing's University Day for National Engineers Week. We will be preparing content to present at that event, and are excited to have representation for the team and for RIT!
Boeing Company Logo

Boeing Company Logo

Plans for Next Phase

High Level Phase Schedule

Subsystem Build & Test

Subsystem Build & Test

Individual Plans

Team Member

James Brumbaugh

Matthew Chase

Brandon Codi

Jacob Kennedy

Nicholas Lindley

Dan Mitchell

Jake Timmons


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