Build & Test Prep
Table of Contents
Project RecapThe High Altitude Balloon Instrumentation Platform (HABIP) is a multi-functional system that allows users to collect and analyze data from near-space experiments. The device records internal data, and also telemeters data that has been gathered from an array of sensors to a ground communications center. The goal of this project is to create the aforementioned array in a configuration that is lightweight, cheap to manufacture, and highly reliable. The final product will undergo a mission lasting for several hours in harsh conditions, and will parachute back to Earth from an altitude of over 100,000 feet to be recovered and analyzed. This project seeks to improve upon the progress of two former MSD groups: P17104 and P17105, and is intended to be a design which can be further improved in the future.
Team Vision for Build & Test Prep Phase
In the short time since the beginning of the semester, the team has focused on getting each subsystem prepared for testing. Due to the nature of the project, many subsystems will be very easy to test independently of each other, while we will only know that other engineering requirements are met upon launch. As such, additional time has been focused on ensuring the integrity of the design to increase the probability of success.
During this phase, the team worked on creating test plans and doing some pre-testing setup, to make the next phase go smoothly and follow a specific procedure. Our risk/problem assessment was updated, and the team had several discussions about how we would approach any unexpected situations.
Test Plan Summaryclick here.
The test plans (below) are designed to ensure that the engineering requirements (above) that were defined in the Project Readiness Package are met.
MSP430 -- Teensy SPI Interface Control Document
The SPI bus between the MSP430 (master) and Teensy microcontroller (slave) is detailed in this ICD.
This text file gives an example of the SD Card file formatting.
Transmitter Power Amplifier
The power amplifier calculations were finalized, paving the way for our last set of large purchases to be completed.
Risk and Problem Tracking
- Potentially not enough bandwidth to transmit/receive
- Dr. Patru is now requesting less data transmission, particularly to accommodate easier integration of complicated digital video system
- Difficulty securing funding
- Boeing now supplying funds
- $1500 is available to the team in total
- Meeting times are challenging to coordinate with
seven team members
- MSD II minor scheduling conflicts have been discussed and handled
- Balloon plug falls on platform or HABIP parachute,
- Fabricating lighter plug
- Parachute on plug ensures diminished descent rate
- Will need to ensure no entanglement of new parachute as well
Excessive time needed to communicate data
- Data transfer speeds improved over last year's team
- Poor fabrication of PCBs is possible
- Testing procedures will determine if this is the case
- Off-shelf components may not work as expected at
altitudes of >100,000 feet
- Limited testing opportunities
- Common mode failure affects redundant subsystems
- Build redundancies into multiple different subsystems (data storage present in multiple places)
New Sources of Risk
- Researched systems do not operate as expected
- Continues to be a risk for complicated assemblies, especially in COMMs
To view the full document, click here.
National Engineers Week ConferenceOur team will be represented by Dan Mitchell at Boeing's University Day for National Engineers Week. We will be preparing content to present at that event, and are excited to have representation for the team and for RIT!
Plans for Next Phase
High Level Phase Schedule