Build & Test Prep
Table of Contents
Team Vision for Build & Test Prep PhaseIn this phase, the parts for the MoonPad++, MoonPad, and BandToy should be procured and the PCB boards should be sent out for fabrication. When all parts and PCBs are received, the development platforms should be assembled and tested for each subsystem functionality. Total system integration and packaging of project is beyond the scope of this phase.
Test Plan Summary - MoonPad++ and MoonPad
S1 Test PlanThe goal of this test is to determine whether or not the LEDs that are built into the board will light up and function per software. The assembled PCB will be connected to a fully charged battery after the board is programmed with the software needed to be run by the developed mobile app. Each LED group of LEDs wil be turned on and off to verify its functionality. When each group of LEDs are on, a light meter will be used to measure the brightness of the LEDs. The units if Lumens will be then converted to millicandelas for analysis. There are 4 LEDs for each color (green, red, blue).
S2 Test PlanThe preliminary goal of the buzzer/speker test is to verify the output of the PIC microcontroller. The secondary goal is to compare the sound intensity in decibels of the amplified design to the non-amplified design in order to meet our intensity goal of 60dB. This will be done by first programinging the microcontroller to output the same tone. Then testing the intensity of the sound in decibels of the amplified and non-amplified designs with an smartphone application.
S3 Test PlanThe goal for this test is to determine the weight of the PCB and assembled components as to not exceed 1kg. Additionally, the goal for the size test is to accurately measure the PCB length, width, and height in order to not exceed 6x6x1 inches.
S4 Test PlanThe goal for this test is to determine the duration of the battery life. The test will consist of running the components all at once until the battery is drained. Increments of 10 minutes will be established and the battery power percentage will be measured and plotted with respect to time. Subsequently, the discharge curve will be produced and the discharge time will be calculated.
Test Plan Summary - BandToy
Risk and Problem TrackingFailure of each test plan is a risk due to likelihood of incorrect schematic and/or PCB design. These risks will be minimized by thorough review of the detailed design prior to part procurement and PCB manufacturing.
If a subsystem does not work, debugging will begin to resolve the issue and revisions of the schematic and PCB will be made accordingly.
Plans for next phaseIn three weeks, we hope to have out PCB design finalized and submitted for manufacturing. We also hope to be receiving the parts that will be needed to assemble the board to begin testing.
The team's general plan can be depicted by the revised schedule below: