P19251: Local Positioning System
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Subsystem Build & Test

Table of Contents

Team Vision for Subsystem Level Build & Test Phase

Summarize:

The Team had big visions for what would be done by the time of the Subsystem build and test review: Mechanical's goal was to design and create a prototype for the enclossure of the final system. Electrical's goal was a finished circuitboard and parts ordered and shipped Software's goal was a completed Proof of concept system.

Electrical designed and Laid out the first board revision. Mechanical completed preliminary designs that work with the current board layout. Software sensor team has converted their C++ libary to C and established stable communication from the ESP32 to the Decawave Module. Software ESP32 team has a partially completed mesh bootup procedure and is working on ESP32 mesh Connection

Current subsystem status

Electrical:

Schematic status: Completed

public/Subsystem Build and test Documents/Schematic.png

public/Subsystem Build and test Documents/Schematic.png

Layout status: Completed

public/Subsystem Build and test Documents/Board Layout.png

public/Subsystem Build and test Documents/Board Layout.png

3D board layout:

public/Subsystem Build and test Documents/Board Layout 3D.png

public/Subsystem Build and test Documents/Board Layout 3D.png

Mechanical

An original concept was created involving handles for ease of attachment to various outside systems:

public/Subsystem Build and test Documents/Preliminary Enclosure 1.png

public/Subsystem Build and test Documents/Preliminary Enclosure 1.png

This was later revised due to the difficulty of snap in handles and to improve overall robustness:

public/Subsystem Build and test Documents/Preliminary enclosure 2.png

public/Subsystem Build and test Documents/Preliminary enclosure 2.png

Testing is planned to determine the robustness of the final design as well as the capability of the design to be waterproof. the prototypes will be fabricated using 3D printing technology with the possibility for further innovation into manufacturing options

Software ESP32 team: currently in the process of booting into, and getting the overall mesh system working.

Software Sensors team: the C library allows for interfacing with the sensors and stable communication has been established between the ESP32's and the Decawave Modules.

Live Tracking Documents

Test Plans

Risk Management

Problem Tracking.

Plans for next phase

According to our current plan the next 3 week stage involves board population and software team subsystem integration.

Mechanically our first enclosure prototype should be created and tested with our first board revision. Software will begin integrating their two subteams allowing electrical to test basic functionality of the boards created in the last phase. Electrical will be populating board revision 1 and will test it electrically while the software team gets to a point where software can be implemented.

3 week plans


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