P19318: Thermochemical Conversion of Food Waste
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Integrated System Build & Test

Table of Contents

Team Vision for Integrated System Build & Test Phase

The scope of this phase encompassed the completion of building both the system integration and electrical subsystems for the project. The main components that had to be completed for the system integration side was the enclosure and the drilling of the BGR. For the electrical side, the main deliverable was the mother/daughter board configuration and getting everything soldered together.

By the end of this phase, the team only managed to accomplish the completion of the enclosure. Progress for the drilling continued, but a few problems such as tool failure and misalignment made it so that the deadline could not be met. For the electrical side, a few components were soldered onto the boards, but the subsystem is not yet complete. Additionally, there were components that were not ordered due to an insufficient BOM from previous phases as well as missing components which caused further delays for the electrical side.

Electrical Assembly Summary

Most additional electrical test plans were not performed as the remainder of them require the system to be completed. Instead, work was performed to complete the system, with just assembly of the major boards left at the end of this phase (the assembly work was delayed because of a loss of major components).

Some of the relevant tests and circuit building were conducted in the EE lab. These different circuits were built on the Printed Circuit board. Components were soldered together to complete both the main board and two daughter boards. For the main board a connector was added to easily interface with the Raspberry Pi.

Electrical Subsystem Test Plan Result

The 'Storage Capability Test' was also conducted in this phase.

Test Name Conclusion
T13 - Storage Capability Test Plan The data (different files) were added to the memory card and this procedure was done couple of times. The set of data was generated by the raspberry pi and was fed into a file which was processed to the memory card. The files were accessed a couple of times to verify the memory card worked fine.

The summary of all the other Test Plans conducted can be seen here: Phase 3 Test Results

Risk and Problem Tracking

Risk Index

Risk Index

The updated FMEA as of 4/2/19 can be found here

Problem Tracker

Problem Tracker

Scorched Drill Bit from Drilling

Scorched Drill Bit from Drilling

Functional Demo Materials

The main board and two daughter boards were assembled according to the circuit designs. The wiring was done such that the connection for the Raspberry Pi was on the side of the main board and the ADC in the center. Then wires were soldered for the appropriate connections. A similar procedure was followed for the daughter boards (causing them to differ slightly), were the connections for the thermocouples are on one side and the connections to the main board are on the other.
Main Board Design Schematic

Main Board Design Schematic

Daughter Board Design Schematic

Daughter Board Design Schematic

The schematic above were constructed and soldered onto the printed circuit board.

Main Board Picture

Main Board Picture

Daughter Board Picture

Daughter Board Picture

Top View of Enclosure

Top View of Enclosure

Side View of Enclosure

Side View of Enclosure

Inside View of Enclosure

Inside View of Enclosure

Plans for next phase

The individual plans for the next phase:

Alex

Brent

Liam

Pak

Shahzain


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