Integrated System Build & Test
Table of Contents
Team Vision for Integrated System Build & Test PhaseThe scope of this phase encompassed the completion of building both the system integration and electrical subsystems for the project. The main components that had to be completed for the system integration side was the enclosure and the drilling of the BGR. For the electrical side, the main deliverable was the mother/daughter board configuration and getting everything soldered together.
By the end of this phase, the team only managed to accomplish the completion of the enclosure. Progress for the drilling continued, but a few problems such as tool failure and misalignment made it so that the deadline could not be met. For the electrical side, a few components were soldered onto the boards, but the subsystem is not yet complete. Additionally, there were components that were not ordered due to an insufficient BOM from previous phases as well as missing components which caused further delays for the electrical side.
Electrical Assembly SummaryMost additional electrical test plans were not performed as the remainder of them require the system to be completed. Instead, work was performed to complete the system, with just assembly of the major boards left at the end of this phase (the assembly work was delayed because of a loss of major components).
Some of the relevant tests and circuit building were conducted in the EE lab. These different circuits were built on the Printed Circuit board. Components were soldered together to complete both the main board and two daughter boards. For the main board a connector was added to easily interface with the Raspberry Pi.
Electrical Subsystem Test Plan Result
The 'Storage Capability Test' was also conducted in this phase.
|T13 - Storage Capability Test Plan||The data (different files) were added to the memory card and this procedure was done couple of times. The set of data was generated by the raspberry pi and was fed into a file which was processed to the memory card. The files were accessed a couple of times to verify the memory card worked fine.|
The summary of all the other Test Plans conducted can be seen here: Phase 3 Test Results
Risk and Problem Tracking
The updated FMEA as of 4/2/19 can be found here
Functional Demo MaterialsThe main board and two daughter boards were assembled according to the circuit designs. The wiring was done such that the connection for the Raspberry Pi was on the side of the main board and the ADC in the center. Then wires were soldered for the appropriate connections. A similar procedure was followed for the daughter boards (causing them to differ slightly), were the connections for the thermocouples are on one side and the connections to the main board are on the other.
The schematic above were constructed and soldered onto the printed circuit board.
Plans for next phase
The individual plans for the next phase: