Subsystem Build & Test
Table of Contents
Team Vision for Subsystem Level Build & Test PhaseThe scope of this phase was to complete the necessary test plans of the system integration and electrical subsystems that did not require the entire integrated system to be built. Additionally, the team planned on getting all parts purchased by the end of the phase. The following were the test plans that the team planned on completing:
System Integration Subsystems
- T2 (Drilling Test Plans)
- T3 (TC Mount Test Plan)
- T13 (Display Test Plan)
- T15 (Resistance Measurement Test Plans)
- T16 (Capacitance Measurement Test Plans)
- T17 (MUX Test Plan)
- T18 (ADC Test Plan)
- T20 (Voltage Amplification Test Plan)
By the end of the phase, the team was able to purchase every part on the Bill of Materials. Additionally, all of the test plans that were planned to be completed were conducted, and the results are documented in the page below.
Test Results SummarySystem Integration Test Plan Results
|T2 - Drilling Test Plan||Based on the test results, the insulation material should be able to be drilled through with no foreseen risk of damage to the surrounding material.|
|T3 - TC Mount Test Plan||Based on the measured dimensions after the test results, the TC mount should be able to be survive holding the thermocouples in the harsh environment while on the firepot. The level of oxidation during the first run was not as extreme as the that experienced during the second test run. This implies there is a large temperature difference between the floor of the carbonizer and the firepot. This level of oxidation experienced does raise reason for concern, and may need to be replaced in the future.|
Electrical Subsystem Test Plan Results
|T13 - Display Test Plan||The touch screen connected correctly to the Raspberry Pi and displays the video properly. The resolution/aspect ratio is not correct yet, but this can be easily adjusted in configuration files. The touch capability works as expected, but without the proper resolution settings an accurate test cannot be performed (although the touch screen still works as intended).|
|T15 - Resistor Test Plans||Based on the tests above, it was concluded that the resistors had almost similar values as printed on them. There is a slight difference which is always there in the capacitors. As three trials were conducted for each of the resistor, the resistors were in working condition and had +-5% tolerance as seen from the values.|
|T16 - Capacitor Test Plan||Based on the results above, both of the capacitors worked properly with no technical problems. The capacitors had the same measured value as the actual one.|
|T17 - MUX Test Plan||As seen in the table above, the multiplexer resistance can be seen to be approximately 80Ω, as reported in the datasheet. Further testing with the ADC as the load should be performed to determine if this resistance may present an accuracy issue. Further testing with the thermocouple as the input is also advised.|
|T18 - ADC Test Plan||On the lower voltages, it is not as accurate, but they are not important because they correspond to lower temperatures (room temp.) which are not critical to our application. For the remaining voltages, the data showed the expected result.|
|T20 Voltage Amplification Test Plan||Based from the results above, the operational amplifier worked pretty well without any technical issues. The gain of the amplifier was greater than 1 which reflected the amplifier in working in good state. The gain from the amplifier was around 22 and could be changed according to the desired output by varying the resistor or the capacitor values.|
The full test plan result document can be found here.
Risk and Problem Tracking
The updated FMEA as of 2/26/19 can be found here.
Functional Demo Materials
Plans for next phaseFor the next phase, the team used the three week plan to document planned activities. The plans were used to populate the next items on the gantt chart. The scope of this phase is to start and finish the implementation of the system integration subsystem and electrical subsystems. The main deliverables are as follows:
- Assemble enclosure exterior (2/28/19-3/7/19)
- Implement electronics with the enclosure (3/7/19-3/19/19)
- Begin Test Runs of entire system (3/19/19-3/29/19)
- Finish Drilling into the BGR (2/28/19 - 3/7/19)
The full Gantt chart can be found here.
Individual Team Visions and Three-Week Plans can be found here.