Subsystem Build & Test
Table of Contents
Team Vision for Subsystem Level Build & Test Phase
What did your team plan to do during this phase?
In the Subsystem Level Build and Test phase, the teams’ plan was to continue testing and focusing on functionality of the SD card. The SD card needed to be tested with the new code that was written to see if it functions properly and saves data. Once the functionality of the SD card is established, we will attempt to save sensor data to the SD card and verify we are receiving the expected data. Furthermore, new parts have been ordered, allowing for us to access the STM laboratory and install the new parts and ensure full functionality of them. We will also continue to update our Gantt Chart, Risk Assessment, and Test Plans for clear documentation. Once the SD card operations successfully, our next focus will develop on the functionality of all sensors. The designs and flowcharts will also be update from the previous phase if anything is changed.
What did your team actually accomplish during this phase?
The remaining parts for the PCB were ordered and mounted onto the board. Additions to the board included a USB port, accelerometer and multiple resistors and capacitors. This was done in the Surface Mount Lab with the assistance of the lab supervisor. Also, the CE's on the team were able to develop a solution to be able to save to the SD card. This was a roadblock for quite some time and is very encouraging to overcome this obstacle. We have begun trying to save sensor data to the SD card and will continue this into the next phase. The accelorometer that was installed on the board also needed to be tested and we are currently working together to verify the functionality of that device. We also ordered a portable DC power supply to allow the CE's to continue working on the code with the board on their own time at their homes instead of having to come into the lab every time. The planning tools of the project including the Gantt chart, risk assessment, and Test plans were also all updated throughout this phase to reflect the teams current progress.
Test Results SummaryAdded Parts to PCB: The Parts added to the board are shown below, and currently code is being written to run a self test on the accelerometer, so that the preciseness of the accelerometer is verified.
Redesign of Enclosure: Nearing completion, working on putting final touches before 3D printing first design.
Summary of Test Plans: test results
- Contact the SMT lab to ensure successful installation of all new sensors, such as the accelerometer and new resistors/capacitors.
- Work with the codebase to ensure that the SD card functionality works. A basic read/write to and from the SD card should be completed such that future sensors can gather that information on the SD card.
- Calculate measurements for the new enclosure such that it can handle higher temperatures and different environment conditions
Inputs & Source
- Accelerometer - Acceleration data must be within 5% of the expected value on bench test.
- Vibration and Torture Testing of System and Enclosure - System must be able to withstand volatile in-car environment
- Mounting Bracket Design and Production - Brackets must be manufactured/adaptable to the various mounting locations within the vehicle.
- Lap Time Acquisition - Configuration of timer module to pair to GPS data for timestamps
- All sensors must acquire data within 5% tolerance.
- Device is able to store at least one hour of data to an external storage device 32GB in size without overwriting buffer
Outputs & Destination
- 5% tolerance of all sensors
- Gain a greater understanding of the source code to move forward and create greater progress
- Continuously compare to other concepts to ensure we are on the right track
- Find better and cost-effective materials to create a stronger box
Risk and Problem Tracking
Functional Demo MaterialsLink to:
Plans for next phaseAs a team, where do you want to be in three weeks at your next demo?
During the Integrated System and Build Test demo, team wants to be further into the completion of team and individual goals for testing of the SD card, testing of the accelerometer, redesign of the enclosure, and modifying of the wire harness. Since the SD card functionality can now be written to correctly, the most important tests for the Integrated System phase is testing the sensors writing data to the SD with meaningful data. The first tests completed will be testing one sensor writing capability at a time and making sure the data is being received by the SD card correctly. Once this test has been completed with multiple single sensors, the team plans to test multiple sensors at a time to see if the bottlenecking of the data being sent to the SD card continues with the new code, and if so to re-write the code so that multiple sensors can be written at a time without losing any meaningful data. These tests are planned to continue through to the Customer Handoff phase. Along with testing the SD card, the accelerometer that has recently been added to the PCB will be testing to see if it gathers precise data. This testing will be done by running a self-test on the accelerometer, with the code that is currently being written to run the test. The accelerometer test is planned to be finished during the Integrated System phase. The redesign of the enclosure and the wire harness modification will also be worked on, and they are planned to be completed during the Customer Handoff phase. The team also plans to complete the weekly objectives of the phase, that are planned at the beginning of the phase, for both individual and team tasks. Some of those tasks will be updating the Risk Management and Problem Tracking, creating more functional demo materials, and starting to prepare for the final project documentation and poster for Imagine RIT.
Individual Three-Week Plans Below:
- Nick Washco:Subsystem Build & Test Plans
- Sahil Gogna:Subsystem Build & Test Plans
- Josh Henderson:Subsystem Build & Test Plans
- Michael Schroeder:Subsystem Build & Test Plans
- Adam Bork:Subsystem Build & Test Plans