Build & Test Prep
Table of Contents
Team Vision for Build & Test Prep PhaseThe team level goals for this phase include debriefing from MSD I and break, testing delivered components, ordering remaining components, and securing the materials needed for testing. The team was able to accomplish these goals, validating that the ordered components work as intended and securing channels to acquire any remaining components. Lab spaces and resources were acquired for testing and design fabrication.
Test Plan SummaryTo verify that the specifications are met, the team has defined a testing protocol which will test the extent to which each requirement was met. Additionally, the upper level test plan log lays out the facilities to be used during testing. An additional document has been added to oversee the validation of ordered components. This ensures that the engineering specifications which are being met with "out-of-the-box" solutions will be actually be met by these components.
Risk and Problem TrackingAs the project begins to materialize, it is critical that the team stay on top of the risk analysis. This will allow us to identify problems as they occur and address them in a timely fashion. Seeing as this phase was only 2 weeks long, there is not much adjustment to be made to the risk analysis. That being said, the subsystem build and test phase will be critical to the risk analysis.
The live risk assessment document can be found here.
Design Review MaterialsThe current version of the HUD frontend will be displayed in a live demonstration during the design review. Static screenshots of the views to be shown can be seen in the images below.
Electrical DesignThe Main Board and Light Board have been updated since the last phase in order to better accommodate both the mechanical needs of the boards and to improve the flow of heat within the design. The purple boards seen are the looks of the final boards being ordered from the PCB company OSH Park. Mounting holes were added to the main board as well as two larger hole at the bottom to relieve mechanical stress and prevent shaking.
The Light Board received the most modification. It also included mounting holes, and the corners had to be cut to better fit within the housing of the shell. The corners were cut instead of the whole board being made circular for ease of creation by the board house and to save money as a result. Traces were moved around the LEDs on the board in order to improve the flow of heat directly to the adjacent LEDs so that heat does not get isolated around one, potentially melting the LEDs. Vias were also added on the central pads of each LED so that heat can be transferred directly from the LEDs to both the upper ground plane and the lower ground plane for better dispersion.